Abstract
This paper describes our new technology for creating a highly productive 0.1 urn gate InGaP/InGaAs HEMT with a GaAs substrate for a millimeter-wave MMIC. We applied a phaseshifting photo lithographic technique and sidewall deposition/etching process to fabricate a 0.1 urn gate electrode. The fabricated HEMTs showed excellent high-frequency performance; An MSG exceeding 10 dB at 60 GHz. We also fabricated a 60 GHz band, four-stage lownoise amplifier MMIC and demonstrated its superior performance (Gain= 27 dB and NF= 3.1 dB @6i GHz). These results strongly suggest that our InGaP/InGaAs HEMTs technologies are highly applicable for millimeter-wave applications.
Original language | English |
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Pages (from-to) | 876-879 |
Number of pages | 4 |
Journal | IEICE Transactions on Electronics |
Volume | E81-C |
Issue number | 6 |
Publication status | Published - 1998 |
Externally published | Yes |
Keywords
- HEMT
- Ingap
- Low noise amplifier
- MMIC
- Nun-wave
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering