@inproceedings{467d589c7d28433a9c9bff3308b21bf5,
title = "320 Gb/s high-speed ATM switching system hardware technologies based on copper-polyimide MCM",
abstract = "This paper describes a 320 Gb/s high-speed multi-chip ATM switching system for broadband ISDN. This system employs a Copper-polyimide MCM with 4-layer copper-polyimide signal transmission layers and 15-layer ceramic power supply layers. The system uses 64 MCMs that are interconnected by 98-highway flexible printed circuit connector. Si-bipolar VLSIs are mounted on MCM using the 150 μm very-thin pitch outer lead TAB technique. In addition, a high-performance heat-pipe air cooling technique is adopted. The system switches ATM cells up to 320 Gb/s throughput and it is applicable for future B-ISDN.",
author = "Naoaki Yamanaka and Endo, {Ken ichi} and Kouichi Genda and Hideki Fukuda and Tohru Kishimoto and Sasaki, {Shin ichi}",
year = "1994",
month = jan,
day = "1",
language = "English",
isbn = "0780309154",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Publ by IEEE",
pages = "776--785",
booktitle = "Proceedings - Electronic Components and Technology Conference",
note = "Proceedings of the 1994 IEEE 44th Electronic Components & Technology Conference ; Conference date: 01-05-1994 Through 04-05-1994",
}