TY - GEN
T1 - 3D clock distribution using vertically/horizontally-coupled resonators
AU - Take, Yasuhiro
AU - Miura, Noriyuki
AU - Ishikuro, Hiroki
AU - Kuroda, Tadahiro
PY - 2013/4/29
Y1 - 2013/4/29
N2 - Clock distribution with low skew, low jitter, and low power for high-performance microprocessors is a significant design challenge. Although traditional H-tree clock distribution circuits are widely used, the clock skew of such circuits is increased by the PVT variations associated with device scaling [1]. In recent years, there has thus been a growing interest in resonant clock distribution schemes for reduced clock skew. In particular, coupled ring oscillators with shorted outputs [2] can reduce skew and jitter without additional layout area compared to LC resonators [3]. The difference in phase and frequency of each oscillator (due to PVT variations) is equalized by the mutual connection between the oscillators. Power dissipation can also be reduced, as the enhanced variability tolerance may permit operation at lower voltages.
AB - Clock distribution with low skew, low jitter, and low power for high-performance microprocessors is a significant design challenge. Although traditional H-tree clock distribution circuits are widely used, the clock skew of such circuits is increased by the PVT variations associated with device scaling [1]. In recent years, there has thus been a growing interest in resonant clock distribution schemes for reduced clock skew. In particular, coupled ring oscillators with shorted outputs [2] can reduce skew and jitter without additional layout area compared to LC resonators [3]. The difference in phase and frequency of each oscillator (due to PVT variations) is equalized by the mutual connection between the oscillators. Power dissipation can also be reduced, as the enhanced variability tolerance may permit operation at lower voltages.
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U2 - 10.1109/ISSCC.2013.6487725
DO - 10.1109/ISSCC.2013.6487725
M3 - Conference contribution
AN - SCOPUS:84876552989
SN - 9781467345132
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 258
EP - 259
BT - 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers
T2 - 2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013
Y2 - 17 February 2013 through 21 February 2013
ER -