TY - GEN
T1 - 6-Axis force/torque sensor for spike pins of sports shoes
AU - Ishido, H.
AU - Takahashi, H.
AU - Nakai, A.
AU - Takahata, T.
AU - Matsumoto, K.
AU - Shimoyama, I.
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/2/26
Y1 - 2015/2/26
N2 - This paper reports on a method to measure forces and torques acting on spike pins of sports shoes. We fabricated a 2 mm × 2 mm × 0.3 mm 6-axis force/torque sensor chip, which consists of 6 piezoresistive beams. From the resistance changes of the 6 beams, 6 components of forces and torques can be detected. The sensor chip was connected to a flexible printed circuit board (PCB) and covered with thin polydimethylsiloxane (PDMS). Then, the sensor chip and flexible PCB were embedded in spike-pin-shaped epoxy resin. We calibrated the spike-pin-shaped sensor, and confirmed that 6-axis forces and torques were able to be detected by the proposed sensor.
AB - This paper reports on a method to measure forces and torques acting on spike pins of sports shoes. We fabricated a 2 mm × 2 mm × 0.3 mm 6-axis force/torque sensor chip, which consists of 6 piezoresistive beams. From the resistance changes of the 6 beams, 6 components of forces and torques can be detected. The sensor chip was connected to a flexible printed circuit board (PCB) and covered with thin polydimethylsiloxane (PDMS). Then, the sensor chip and flexible PCB were embedded in spike-pin-shaped epoxy resin. We calibrated the spike-pin-shaped sensor, and confirmed that 6-axis forces and torques were able to be detected by the proposed sensor.
UR - http://www.scopus.com/inward/record.url?scp=84931078317&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84931078317&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2015.7050937
DO - 10.1109/MEMSYS.2015.7050937
M3 - Conference contribution
AN - SCOPUS:84931078317
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 257
EP - 260
BT - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
Y2 - 18 January 2015 through 22 January 2015
ER -