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6 W/25 mm2 wireless power transmission for non-contact wafer-level testing
Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda
Research output: Contribution to journal › Article › peer-review
2
Citations
(Scopus)