80 Gbit/s ATM switch MCM based on multilayer ceramic technology

K. Okazaki; N. Sugiura; A. Harada; N. Yamanaka; E. Oki

doi:10.1049/el:19991410

80 Gbit/s ATM switch MCM based on multilayer ceramic technology

K. Okazaki, N. Sugiura, A. Harada, N. Yamanaka, E. Oki

Research output: Contribution to journal › Article › peer-review

Abstract

An 80 Gbit/s asynchronous transfer mode (ATM) switch multichip module (MCM) of dimensions 114×160×6.5 mm has been fabricated. This MCM can support high-density mounting and high-speed interconnection among large-scale-integrated (LSI) chips. Using LSI, ceramic-substrate, high-speed/high-power connector, and compact liquid-cooling technologies, an 80 Gbit/s ATM switching module has been built.

Original language	English
Pages (from-to)	2074-2076
Number of pages	3
Journal	Electronics Letters
Volume	35
Issue number	24
DOIs	https://doi.org/10.1049/el:19991410
Publication status	Published - 1999 Nov 25
Externally published	Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.1049/el:19991410

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abstract = "An 80 Gbit/s asynchronous transfer mode (ATM) switch multichip module (MCM) of dimensions 114×160×6.5 mm has been fabricated. This MCM can support high-density mounting and high-speed interconnection among large-scale-integrated (LSI) chips. Using LSI, ceramic-substrate, high-speed/high-power connector, and compact liquid-cooling technologies, an 80 Gbit/s ATM switching module has been built.",

author = "K. Okazaki and N. Sugiura and A. Harada and N. Yamanaka and E. Oki",

year = "1999",

month = nov,

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doi = "10.1049/el:19991410",

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journal = "Electronics Letters",

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AU - Okazaki, K.

AU - Sugiura, N.

AU - Harada, A.

AU - Yamanaka, N.

AU - Oki, E.

PY - 1999/11/25

Y1 - 1999/11/25

N2 - An 80 Gbit/s asynchronous transfer mode (ATM) switch multichip module (MCM) of dimensions 114×160×6.5 mm has been fabricated. This MCM can support high-density mounting and high-speed interconnection among large-scale-integrated (LSI) chips. Using LSI, ceramic-substrate, high-speed/high-power connector, and compact liquid-cooling technologies, an 80 Gbit/s ATM switching module has been built.

AB - An 80 Gbit/s asynchronous transfer mode (ATM) switch multichip module (MCM) of dimensions 114×160×6.5 mm has been fabricated. This MCM can support high-density mounting and high-speed interconnection among large-scale-integrated (LSI) chips. Using LSI, ceramic-substrate, high-speed/high-power connector, and compact liquid-cooling technologies, an 80 Gbit/s ATM switching module has been built.

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80 Gbit/s ATM switch MCM based on multilayer ceramic technology

Abstract

ASJC Scopus subject areas

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