Abstract
We have developed an ATM switch ceramic multichip module (MCM) that has an aluminum substrate. This MCM can support a high-density mounting and high-speed interconnection among LSI chips. Using LSI technology, ceramic-substrate technology, high-speed/high-power connector technology, and compact liquid-cooling technology, we built an 80-Gbit/s ATM switching module.
| Original language | English |
|---|---|
| Pages (from-to) | 284-288 |
| Number of pages | 5 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3830 |
| Publication status | Published - 1999 |
| Externally published | Yes |
| Event | Proceedings of the 1999 International Conference on High Density Packaging and MCMs - Denver, CO, USA Duration: 1999 Apr 6 → 1999 Apr 9 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering