TY - GEN
T1 - 90-degree bent core polymer optical waveguide coupler for low loss lens-less light coupling between laser / photodetector and fiber
AU - Suemori, Daiki
AU - Ishii, Maho
AU - Kohmu, Naohiro
AU - Ishigure, Takaaki
N1 - Funding Information:
This work was partially supported by a research grant from the Foundation for Technology Promotion of Electronic Circuit Board.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - In this paper, we present direct fabrication of vertically 90-degree bent core polymer optical waveguide couplers to be integrated in optical engines enabling lens-less light coupling between laser source / photodetector and fiber with low loss. We apply the Mosquito method that we developed as a fabrication technique for single-mode and multimode polymer optical waveguides with circular cores. Because of the unique fabrication procedures of the Mosquito method, three-dimensional core alignment is possible, and thus 90° bent core can be formed directly on a laser chip. We would like to emphasize that the bending radius as small as 2 mm or less could be formed, while the insertion loss of the waveguide is as low as 5 dB.
AB - In this paper, we present direct fabrication of vertically 90-degree bent core polymer optical waveguide couplers to be integrated in optical engines enabling lens-less light coupling between laser source / photodetector and fiber with low loss. We apply the Mosquito method that we developed as a fabrication technique for single-mode and multimode polymer optical waveguides with circular cores. Because of the unique fabrication procedures of the Mosquito method, three-dimensional core alignment is possible, and thus 90° bent core can be formed directly on a laser chip. We would like to emphasize that the bending radius as small as 2 mm or less could be formed, while the insertion loss of the waveguide is as low as 5 dB.
KW - component
KW - on-board optical engine
KW - polymer optical waveguide
KW - the Mosquito method
KW - vertically bent core
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U2 - 10.1109/ECTC51906.2022.00076
DO - 10.1109/ECTC51906.2022.00076
M3 - Conference contribution
AN - SCOPUS:85134674838
T3 - Proceedings - Electronic Components and Technology Conference
SP - 436
EP - 440
BT - Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 72nd IEEE Electronic Components and Technology Conference, ECTC 2022
Y2 - 31 May 2022 through 3 June 2022
ER -