A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme

Noriyuki Miura; Daisuke Mizoguchi; Mari Inoue; Hiroo Tsuji; Takayasu Sakurai; Tadahiro Kuroda

A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme

Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Hiroo Tsuji, Takayasu Sakurai, Tadahiro Kuroda

Research output: Contribution to journal › Conference article › peer-review

Abstract

An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.

Original language	English
Article number	14.5
Pages (from-to)	210-211+602
Journal	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume	48
Publication status	Published - 2005 Dec 6
Event	2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States Duration: 2005 Feb 6 → 2005 Feb 10

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Cite this

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title = "A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme",

abstract = "An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.",

author = "Noriyuki Miura and Daisuke Mizoguchi and Mari Inoue and Hiroo Tsuji and Takayasu Sakurai and Tadahiro Kuroda",

year = "2005",

month = dec,

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language = "English",

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journal = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

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note = "2005 IEEE International Solid-State Circuits Conference, ISSCC ; Conference date: 06-02-2005 Through 10-02-2005",

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AU - Miura, Noriyuki

AU - Mizoguchi, Daisuke

AU - Inoue, Mari

AU - Tsuji, Hiroo

AU - Sakurai, Takayasu

AU - Kuroda, Tadahiro

PY - 2005/12/6

Y1 - 2005/12/6

N2 - An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.

AB - An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.

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M3 - Conference article

AN - SCOPUS:28144442025

SN - 0193-6530

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SP - 210-211+602

JO - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

JF - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

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T2 - 2005 IEEE International Solid-State Circuits Conference, ISSCC

Y2 - 6 February 2005 through 10 February 2005

ER -

A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme

Abstract

ASJC Scopus subject areas

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