A 1Tb/s 3W inductive-coupling transceiver chip

Noriyuki Miura; Tadahiro Kuroda

doi:10.1109/ASPDAC.2007.357798

A 1Tb/s 3W inductive-coupling transceiver chip

Noriyuki Miura, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

12 Citations (Scopus)

Abstract

A 1Tb/s 3W inter-chip transceiver transmits clock and data by inductive coupling at a clock rate of 1GHz and data rate of 1Gb/s per channel. 1024 data transceivers are arranged with a pitch of 30μm in a layout area of 1mm ². The total layout area including 16 clock transceivers is 2mm ² in 0.18μm CMOS and the chip thickness is reduced to 10μm. Simple yet accurate model of inductive coupling is utilized for transceiver design. Bi-Phase Modulation (BPM) is employed for the data link to improve noise immunity, reducing power in the transceiver. 4-phase Time Division Multiplexing (TDM) reduces crosstalk and channel pitch. The BER is lower than 10 ^-13 with 150ps timing margin.

Original language	English
Title of host publication	Proceedings of the ASP-DAC 2007 - Asia and South Pacific Design Automation Conference 2007
Pages	92-93
Number of pages	2
DOIs	https://doi.org/10.1109/ASPDAC.2007.357798
Publication status	Published - 2007 Dec 1
Event	ASP-DAC 2007 - Asia and South Pacific Design Automation Conference 2007 - Yokohama, Japan Duration: 2007 Jan 23 → 2007 Jan 27

Publication series

Name	Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

Other	ASP-DAC 2007 - Asia and South Pacific Design Automation Conference 2007
Country/Territory	Japan
City	Yokohama
Period	07/1/23 → 07/1/27

ASJC Scopus subject areas

Computer Science Applications
Computer Graphics and Computer-Aided Design
Electrical and Electronic Engineering

Access to Document

10.1109/ASPDAC.2007.357798

Cite this

A 1Tb/s 3W inductive-coupling transceiver chip. / Miura, Noriyuki; Kuroda, Tadahiro.
Proceedings of the ASP-DAC 2007 - Asia and South Pacific Design Automation Conference 2007. 2007. p. 92-93 4196002 (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Miura, N & Kuroda, T 2007, A 1Tb/s 3W inductive-coupling transceiver chip. in Proceedings of the ASP-DAC 2007 - Asia and South Pacific Design Automation Conference 2007., 4196002, Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC, pp. 92-93, ASP-DAC 2007 - Asia and South Pacific Design Automation Conference 2007, Yokohama, Japan, 07/1/23. https://doi.org/10.1109/ASPDAC.2007.357798

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A 1Tb/s 3W inductive-coupling transceiver chip

Abstract

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