Abstract
A frequency drift of open-loop PLL is an issue for the direct-modulation applications such as Bluetooth transceiver. The drift mainly comes from a temperature variation of VCO during the transmission operation. In this paper, we propose the optimum location of the VCO, considering the temperature gradient through the whole-chip thermal analysis. Moreover, a novel temperature- compensated VCO, employing a new biasing scheme, is proposed. The combination of these two techniques enables the power reduction of the transmitter by 33% without sacrificing the performance.
Original language | English |
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Pages (from-to) | 490-495 |
Number of pages | 6 |
Journal | IEICE Transactions on Electronics |
Volume | E88-C |
Issue number | 4 |
DOIs | |
Publication status | Published - 2005 Apr |
Externally published | Yes |
Keywords
- Bluetooth
- CMOS LC-VCO
- Direct modulation
- GFSK
- Low power
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering