TY - GEN
T1 - A 3D-printed Haptic Material Library for Quantifying the Force-Displacement Relationship
AU - Nakatani, Masashi
AU - Imura, Masataka
AU - Yamazaki, Yoichi
AU - Okazaki, Taisuke
AU - Asano, Yoshihiro
AU - Nakamura, Ryota
AU - Nagata, Noriko
AU - Tanaka, Hiroya
N1 - Funding Information:
*This work was supported by JST COI Grant Number JPMJCE1314. 1Faculty of Environment and Information Studies, Keio University, 5322 Endo Kanagawa, Japan {mn2598, htanaka}@sfc.keio.ac.jp 2School of Science and Technology, Kwansei Gakuin University, Sanda, Hyogo 669-1337, Japan {m.imura, y-yamazaki, nagata}@kwansei.ac.jp
Publisher Copyright:
© 2021 IEEE.
PY - 2021/7/6
Y1 - 2021/7/6
N2 - 3D printing technology enables us to develop a composite shape of complex structures. This study describes the methodology of how haptic materials are developed using 3D printers. We present a material library to study haptic softness and texture perception.
AB - 3D printing technology enables us to develop a composite shape of complex structures. This study describes the methodology of how haptic materials are developed using 3D printers. We present a material library to study haptic softness and texture perception.
UR - http://www.scopus.com/inward/record.url?scp=85115191128&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85115191128&partnerID=8YFLogxK
U2 - 10.1109/WHC49131.2021.9517178
DO - 10.1109/WHC49131.2021.9517178
M3 - Conference contribution
AN - SCOPUS:85115191128
T3 - 2021 IEEE World Haptics Conference, WHC 2021
SP - 585
BT - 2021 IEEE World Haptics Conference, WHC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE World Haptics Conference, WHC 2021
Y2 - 6 July 2021 through 9 July 2021
ER -