TY - GEN
T1 - A 4.7Gb/s inductive coupling interposer with dual mode modem
AU - Kawai, Shusuke
AU - Ishikuro, Hiroki
AU - Kuroda, Tadahiro
PY - 2009/11/18
Y1 - 2009/11/18
N2 - A 4.7Gb/s inductive coupling interposer is demonstrated with a bit error rate less than 10-12. The misaligned inductor pair on two separate chips are connected through an interposer. A dual mode modem is proposed to extend the range of interconnecting transmission line length to counteract the reduction as process scales.
AB - A 4.7Gb/s inductive coupling interposer is demonstrated with a bit error rate less than 10-12. The misaligned inductor pair on two separate chips are connected through an interposer. A dual mode modem is proposed to extend the range of interconnecting transmission line length to counteract the reduction as process scales.
UR - http://www.scopus.com/inward/record.url?scp=70449348259&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=70449348259&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:70449348259
SN - 9784863480018
T3 - IEEE Symposium on VLSI Circuits, Digest of Technical Papers
SP - 92
EP - 93
BT - 2009 Symposium on VLSI Circuits
T2 - 2009 Symposium on VLSI Circuits
Y2 - 16 June 2009 through 18 June 2009
ER -