TY - JOUR
T1 - A 65fJ/b inter-chip inductive-coupling data transceivers using charge-recycling technique for low-power inter-chip communication in 3-D system integration
AU - Niitsu, Kiichi
AU - Kawai, Shusuke
AU - Miura, Noriyuki
AU - Ishikuro, Hiroki
AU - Kuroda, Tadahiro
N1 - Funding Information:
Manuscript received April 23, 2010; revised January 04, 2011; accepted April 06, 2011. Date of publication June 16, 2011; date of current version June 01, 2012. This work was supported by VLSI Design and Education Center (VDEC), the University of Tokyo in collaboration with Synopsys, Inc., Cadence Design Systems, Inc., Mentor Graphics, Inc., and Agilent Technologies Japan, Ltd.
PY - 2012
Y1 - 2012
N2 - This paper presents a low-power inductive-coupling link in 90-nm CMOS. Our newly proposed transmitter circuit uses a charge-recycling technique for power-aware 3-D system integration. The cross-type daisy chain enables charge recycling and achieves power reduction without sacrificing communication performance such as a high timing margin, low bit error rate and high bandwidth. There are two design issues in the cross-type daisy chain: pulse amplitude reduction and another is inter-channel skew. To compensate for these issues, an inductor design and a replica circuit are proposed and investigated. Test chips were designed and fabricated in 90-nm CMOS to verify the validity of the proposed transmitter. Measurements revealed that the proposed cross-type daisy chain transmitter achieved an energy efficiency of 65 fJ/bit without degrading the timing margin, data rate, or bit error rate. In order to investigate the compatibility of the transmitter with technology scaling, a simulation of each technology node was performed. The simulation results indicate that the energy dissipation can be potentially reduced to less than 10 fJ/bit in 22 nm CMOS with proposed cross-type daisy chain.
AB - This paper presents a low-power inductive-coupling link in 90-nm CMOS. Our newly proposed transmitter circuit uses a charge-recycling technique for power-aware 3-D system integration. The cross-type daisy chain enables charge recycling and achieves power reduction without sacrificing communication performance such as a high timing margin, low bit error rate and high bandwidth. There are two design issues in the cross-type daisy chain: pulse amplitude reduction and another is inter-channel skew. To compensate for these issues, an inductor design and a replica circuit are proposed and investigated. Test chips were designed and fabricated in 90-nm CMOS to verify the validity of the proposed transmitter. Measurements revealed that the proposed cross-type daisy chain transmitter achieved an energy efficiency of 65 fJ/bit without degrading the timing margin, data rate, or bit error rate. In order to investigate the compatibility of the transmitter with technology scaling, a simulation of each technology node was performed. The simulation results indicate that the energy dissipation can be potentially reduced to less than 10 fJ/bit in 22 nm CMOS with proposed cross-type daisy chain.
KW - CMOS integrated circuits (ICs)
KW - low-power design
KW - wireless communication
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U2 - 10.1109/TVLSI.2011.2150252
DO - 10.1109/TVLSI.2011.2150252
M3 - Article
AN - SCOPUS:84862012428
SN - 1063-8210
VL - 20
SP - 1285
EP - 1294
JO - IEEE Transactions on Very Large Scale Integration (VLSI) Systems
JF - IEEE Transactions on Very Large Scale Integration (VLSI) Systems
IS - 7
M1 - 5887438
ER -