A study of multi-stack silicon-direct wafer bonding for MEMS manufacturing

N. Miki; X. Zhang; R. Khanna; A. A. Ayún; D. Ward; S. M. Spearing

doi:10.1109/MEMSYS.2002.984289

A study of multi-stack silicon-direct wafer bonding for MEMS manufacturing

N. Miki, X. Zhang, R. Khanna, A. A. Ayún, D. Ward, S. M. Spearing

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional microstructures, such as for power MEMS devices. However, there are several bonding issues that MEMS technologists have to face and overcome to successfully build multilayered structures. Among these are: (1) Chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding, (2) Increased stiffness due to multiple bonded wafers and/or thick wafers, (3) Bonding tool effects, and (4) Defect propagation to other wafer levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any MEMS project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.

Original language	English
Pages (from-to)	407-410
Number of pages	4
Journal	Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
DOIs	https://doi.org/10.1109/MEMSYS.2002.984289
Publication status	Published - 2002 Jan 1
Externally published	Yes

ASJC Scopus subject areas

Mechanical Engineering
Electrical and Electronic Engineering
Control and Systems Engineering

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10.1109/MEMSYS.2002.984289

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A study of multi-stack silicon-direct wafer bonding for MEMS manufacturing

Abstract

ASJC Scopus subject areas

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