TY - GEN
T1 - A thermal pattern design for providing dynamic thermal feedback on the face with head mounted displays
AU - Chen, Zikun
AU - Peiris, Roshan Lalintha
AU - Minamizawa, Kouta
N1 - Publisher Copyright:
© 2017 ACM.
PY - 2017/3/20
Y1 - 2017/3/20
N2 - This paper presents our preliminary exploration of providing dynamic thermal haptic feedback on the face. We have designed a thermal feedback prototype that integrates Peltier modules directly with a head mounted display which is able to provide thermal output directly on users' faces. We explored the possibility of providing dynamic thermal feedback which could present information and enhance user experience through designing four initial dynamic thermal patterns of our prototype. We also conducted a preliminary user experiment and analysis of the design of different patterns ("dynamic information") to evaluate the design on three aspects, the accuracy of recognition of dynamic stimuli, smoothness of the movement and comfort level. Our results indicate that the accuracy of recognition of dynamic stimuli was approximately 71.84%.
AB - This paper presents our preliminary exploration of providing dynamic thermal haptic feedback on the face. We have designed a thermal feedback prototype that integrates Peltier modules directly with a head mounted display which is able to provide thermal output directly on users' faces. We explored the possibility of providing dynamic thermal feedback which could present information and enhance user experience through designing four initial dynamic thermal patterns of our prototype. We also conducted a preliminary user experiment and analysis of the design of different patterns ("dynamic information") to evaluate the design on three aspects, the accuracy of recognition of dynamic stimuli, smoothness of the movement and comfort level. Our results indicate that the accuracy of recognition of dynamic stimuli was approximately 71.84%.
KW - Dynamic thermal
KW - Head mounted display
KW - Thermal display
KW - Thermal haptics
UR - http://www.scopus.com/inward/record.url?scp=85018627135&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85018627135&partnerID=8YFLogxK
U2 - 10.1145/3024969.3025060
DO - 10.1145/3024969.3025060
M3 - Conference contribution
AN - SCOPUS:85018627135
T3 - TEI 2017 - Proceedings of the 11th International Conference on Tangible, Embedded, and Embodied Interaction
SP - 381
EP - 388
BT - TEI 2017 - Proceedings of the 11th International Conference on Tangible, Embedded, and Embodied Interaction
PB - Association for Computing Machinery, Inc
T2 - 11th ACM International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2017
Y2 - 20 March 2017 through 23 March 2017
ER -