Active control of surface integrity in thin film scratching and finishing

Wu Le Zhu, Wei Gao, Fang Han, Qi Sun, Bingchun Jia, Peipei Jing, Bing Feng Ju, Anthony Beaucamp

Research output: Contribution to journalArticlepeer-review

Abstract

Thin films are widely adopted to improve resistance to chemicals, high temperature, etc. However, their hard and brittle nature imposes great challenges to achieve satisfactory surface integrity control in finishing process. To address this, an active bending methodology via piezoelectric actuator is proposed to investigate the thin film response on and beneath the surface, under different stress states. An analytical model is established and verified by experiments, which demonstrate distinct nano scratching regimes on a Si3N4 film. Based on this active stress control approach, macroscale bonnet polishing was conducted and showed great improvement in surface roughness and material removal.

Original languageEnglish
JournalCIRP Annals
DOIs
Publication statusAccepted/In press - 2024

Keywords

  • Stress
  • Surface integrity
  • Thin film

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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