Adhesion energy of Cu/polyimide interface in flexible printed circuits

Shoji Kamiya, Harunori Furuta, Masaki Omiya

Research output: Contribution to journalArticlepeer-review

42 Citations (Scopus)


The adhesion strength of interfaces was evaluated for two Cu/polyimide laminates, which had the same interface but different polyimide film thickness. A new technique was applied to evaluate the bond energy of the interface, where micro scale polyimide film blocks were scratched off from the interface-side surface of the copper film. Energy consumed during plastic deformation was successfully calculated with the help of a numerical simulation for crack extension. Contrary to the results of conventional peel tests which yielded 340 J/m 2 and 580 J/m 2, respectively for the two samples, the interfacial adhesion energy was obtained as 30 J/m 2 and 25 J/m 2 by the new technique.

Original languageEnglish
Pages (from-to)1084-1088
Number of pages5
JournalSurface and Coatings Technology
Issue number4-7
Publication statusPublished - 2007 Dec 15
Externally publishedYes


  • Adhesion
  • Cu/polyimide interface
  • Energy
  • Flexible printed circuit
  • Plastic deformation
  • Strength

ASJC Scopus subject areas

  • General Chemistry
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry


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