TY - GEN
T1 - Advanced ATM switching system hardware technology using MCM-D, stacking RAM microprocessor module
AU - Yamanaka, N.
AU - Kawamura, T.
AU - Kaizu, K.
AU - Harada, A.
PY - 1998/1/1
Y1 - 1998/1/1
N2 - This paper describes newly developed advanced ATM switching system hardware structures based on MCM-D micro-processor modules. The Si-Substrate MCM-D technology which integrates micro-processor, interface control and peripheral control custom VLSIs, high-speed S-RAMS, and FPGAs (Field Programmable Gate Arrays) is employed. An MCM-D micro-processor module is realized by combining a Motorola 68030, high-performance ASICs, and high-speed S-RAM caches. This is made possible by high density packaging and high-speed 4M-byte with parity cache using 25 ns access to 4-Mbit of S-RAM memory. The MCM employs 12 S-RAMS, possible with the stacked RAM technique, to reduce the module size by 718 compared to conventional surface mounting modules. This micro-processor module technology and MCM technology will advance the development of practical B-ISDN ATM switching systems.
AB - This paper describes newly developed advanced ATM switching system hardware structures based on MCM-D micro-processor modules. The Si-Substrate MCM-D technology which integrates micro-processor, interface control and peripheral control custom VLSIs, high-speed S-RAMS, and FPGAs (Field Programmable Gate Arrays) is employed. An MCM-D micro-processor module is realized by combining a Motorola 68030, high-performance ASICs, and high-speed S-RAM caches. This is made possible by high density packaging and high-speed 4M-byte with parity cache using 25 ns access to 4-Mbit of S-RAM memory. The MCM employs 12 S-RAMS, possible with the stacked RAM technique, to reduce the module size by 718 compared to conventional surface mounting modules. This micro-processor module technology and MCM technology will advance the development of practical B-ISDN ATM switching systems.
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U2 - 10.1109/ECTC.1998.678812
DO - 10.1109/ECTC.1998.678812
M3 - Conference contribution
AN - SCOPUS:0031631131
SN - 0780345266
T3 - Proceedings - Electronic Components and Technology Conference
SP - 884
EP - 888
BT - 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 48th Electronic Components and Technology Conference, ECTC 1998
Y2 - 25 May 1998 through 28 May 1998
ER -