Abstract
An exponentially Increasing number of wireless-LAN (WLAN) devices In a dense environment causes a decrease in throughput owing to collisions among the devices and the lack of contiguous bandwidth. The next-generation standard of 802.11ax improves spectrum efficiency by additionally supporting 1024 (1K) QAM, OFDMA with 80+80MHz; these impose several challenges to silicon design. 1K-QAM demands extreme IQ balance with an IRR better than -50dB over a wide frequency range up to 80MHz to achieve at least -35dB RX EVM or less. Noise characteristics better than -44dBc LO integrated phase noise as well as 50dB isolation between each TRX chain are mandatory. To best make use of the essential features defined in the 11ax standard, a real-time and arbitrary spectrum-resource control capability at each access point (AP) is beneficial both in terms of further improvement in spectrum efficiency as well as communication reliability in ISM coexisting bands and legacy WLAN. Interference identification of the order of 10μϵ while incorporating everything into a strictly limited silicon area is key to launching the advanced unique functionality. This paper presents a fully integrated 4×4 802.11abgn/ac/ax-compliant AP transceiver SoC. The chip offers frequency-dependent IQ (FD-IQ) mismatch calibration for both amplitude and phase, low-noise TX BB and multimode LO distribution techniques, and real-time interference detection including 2.4GHz inverter-type microwave (MW) ovens.
Original language | English |
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Title of host publication | 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 442-444 |
Number of pages | 3 |
ISBN (Electronic) | 9781509049394 |
DOIs | |
Publication status | Published - 2018 Mar 8 |
Externally published | Yes |
Event | 65th IEEE International Solid-State Circuits Conference, ISSCC 2018 - San Francisco, United States Duration: 2018 Feb 11 → 2018 Feb 15 |
Publication series
Name | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
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Volume | 61 |
ISSN (Print) | 0193-6530 |
Other
Other | 65th IEEE International Solid-State Circuits Conference, ISSCC 2018 |
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Country/Territory | United States |
City | San Francisco |
Period | 18/2/11 → 18/2/15 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering