An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package

Hiroki Ishikuro; Toshihiko Sugahara; Tadahiro Kuroda

doi:10.1109/ISSCC.2007.373443

An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package

Hiroki Ishikuro, Toshihiko Sugahara, Tadahiro Kuroda

Department of Electronics and Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

32 Citations (Scopus)

Abstract

A wireless logic-probing system is presented as one of the applications of the millimeter-range carrierless inductive-coupling technique. A pulse transceiver for a wireless probe and its target LSI is fabricated using a 0.25μm standard CMOS logic process. A maximum data rate of 20Mb/s and a communication range of 1.2mm is achieved.

Original language	English
Title of host publication	2007 IEEE International Solid-State Circuits Conference, ISSCC - Digest of Technical Papers
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	360-608
Number of pages	249
ISBN (Print)	1424408539, 9781424408535
DOIs	https://doi.org/10.1109/ISSCC.2007.373443
Publication status	Published - 2007
Event	54th IEEE International Solid-State Circuits Conference, ISSCC 2007 - San Francisco, CA, United States Duration: 2007 Feb 11 → 2007 Feb 15

Publication series

Name	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
ISSN (Print)	0193-6530

Other

Other	54th IEEE International Solid-State Circuits Conference, ISSCC 2007
Country/Territory	United States
City	San Francisco, CA
Period	07/2/11 → 07/2/15

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ISSCC.2007.373443

Cite this

Ishikuro, H., Sugahara, T., & Kuroda, T. (2007). An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package. In 2007 IEEE International Solid-State Circuits Conference, ISSCC - Digest of Technical Papers (pp. 360-608). Article 4242414 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2007.373443

An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package. / Ishikuro, Hiroki; Sugahara, Toshihiko; Kuroda, Tadahiro.
2007 IEEE International Solid-State Circuits Conference, ISSCC - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2007. p. 360-608 4242414 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ishikuro, H, Sugahara, T & Kuroda, T 2007, An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package. in 2007 IEEE International Solid-State Circuits Conference, ISSCC - Digest of Technical Papers., 4242414, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, Institute of Electrical and Electronics Engineers Inc., pp. 360-608, 54th IEEE International Solid-State Circuits Conference, ISSCC 2007, San Francisco, CA, United States, 07/2/11. https://doi.org/10.1109/ISSCC.2007.373443

Ishikuro H, Sugahara T, Kuroda T. An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package. In 2007 IEEE International Solid-State Circuits Conference, ISSCC - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc. 2007. p. 360-608. 4242414. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). doi: 10.1109/ISSCC.2007.373443

Ishikuro, Hiroki ; Sugahara, Toshihiko ; Kuroda, Tadahiro. / An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package. 2007 IEEE International Solid-State Circuits Conference, ISSCC - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2007. pp. 360-608 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

@inproceedings{89a306148a904800becac6523389e33b,

title = "An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package",

abstract = "A wireless logic-probing system is presented as one of the applications of the millimeter-range carrierless inductive-coupling technique. A pulse transceiver for a wireless probe and its target LSI is fabricated using a 0.25μm standard CMOS logic process. A maximum data rate of 20Mb/s and a communication range of 1.2mm is achieved.",

author = "Hiroki Ishikuro and Toshihiko Sugahara and Tadahiro Kuroda",

year = "2007",

doi = "10.1109/ISSCC.2007.373443",

language = "English",

isbn = "1424408539",

series = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "360--608",

booktitle = "2007 IEEE International Solid-State Circuits Conference, ISSCC - Digest of Technical Papers",

note = "54th IEEE International Solid-State Circuits Conference, ISSCC 2007 ; Conference date: 11-02-2007 Through 15-02-2007",

}

TY - GEN

T1 - An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package

AU - Ishikuro, Hiroki

AU - Sugahara, Toshihiko

AU - Kuroda, Tadahiro

PY - 2007

Y1 - 2007

N2 - A wireless logic-probing system is presented as one of the applications of the millimeter-range carrierless inductive-coupling technique. A pulse transceiver for a wireless probe and its target LSI is fabricated using a 0.25μm standard CMOS logic process. A maximum data rate of 20Mb/s and a communication range of 1.2mm is achieved.

AB - A wireless logic-probing system is presented as one of the applications of the millimeter-range carrierless inductive-coupling technique. A pulse transceiver for a wireless probe and its target LSI is fabricated using a 0.25μm standard CMOS logic process. A maximum data rate of 20Mb/s and a communication range of 1.2mm is achieved.

UR - http://www.scopus.com/inward/record.url?scp=34548847971&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34548847971&partnerID=8YFLogxK

U2 - 10.1109/ISSCC.2007.373443

DO - 10.1109/ISSCC.2007.373443

M3 - Conference contribution

AN - SCOPUS:34548847971

SN - 1424408539

SN - 9781424408535

T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

SP - 360

EP - 608

BT - 2007 IEEE International Solid-State Circuits Conference, ISSCC - Digest of Technical Papers

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 54th IEEE International Solid-State Circuits Conference, ISSCC 2007

Y2 - 11 February 2007 through 15 February 2007

ER -

An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package

Abstract

Publication series

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this