An extended XY coil for noise reduction in inductive-coupling link

Mitsuko Saito; Kazutaka Kasuga; Tsutomu Takeya; Noriyuki Miura; Tadahiro Kuroda

doi:10.1109/ASSCC.2009.5357248

An extended XY coil for noise reduction in inductive-coupling link

Mitsuko Saito, Kazutaka Kasuga, Tsutomu Takeya, Noriyuki Miura, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

14 Citations (Scopus)

Abstract

Inductive-coupling link between stacked chips in a package communicates by using coils made by on-chip Interconnections. An XY-coil layout style allows logic interconnections to go through the coil, which significantly saves Interconnection resources consumed by the coil. However, the logic interconnections generate capacitive-coupling noise on the coil and degrade signal in the inductive-coupling link. In this paper, an extended XY coil with ground shields is presented for noise reduction. Simulation study shows that the noise voltage is reduced to 1/5 of the conventional XY coil. This noise reduction enables to reduce transmit power required for the same BER. Test-chip measurement in 0.18μm CMOS demonstrates that the transmit power at 1Gb/s with BER<10^-12 is reduced by 60% compared to the conventional XY coil.

Original language	English
Title of host publication	Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
Pages	305-308
Number of pages	4
DOIs	https://doi.org/10.1109/ASSCC.2009.5357248
Publication status	Published - 2009 Dec 1
Event	2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009 - Taipei, Taiwan, Province of China Duration: 2009 Nov 16 → 2009 Nov 18

Publication series

Name	Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009

Conference

Conference	2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
Country/Territory	Taiwan, Province of China
City	Taipei
Period	09/11/16 → 09/11/18

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/ASSCC.2009.5357248

Cite this

Saito, M., Kasuga, K., Takeya, T., Miura, N., & Kuroda, T. (2009). An extended XY coil for noise reduction in inductive-coupling link. In Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009 (pp. 305-308). Article 5357248 (Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009). https://doi.org/10.1109/ASSCC.2009.5357248

An extended XY coil for noise reduction in inductive-coupling link. / Saito, Mitsuko; Kasuga, Kazutaka; Takeya, Tsutomu et al.
Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009. 2009. p. 305-308 5357248 (Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Saito, M, Kasuga, K, Takeya, T, Miura, N & Kuroda, T 2009, An extended XY coil for noise reduction in inductive-coupling link. in Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009., 5357248, Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009, pp. 305-308, 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009, Taipei, Taiwan, Province of China, 09/11/16. https://doi.org/10.1109/ASSCC.2009.5357248

Saito M, Kasuga K, Takeya T, Miura N, Kuroda T. An extended XY coil for noise reduction in inductive-coupling link. In Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009. 2009. p. 305-308. 5357248. (Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009). doi: 10.1109/ASSCC.2009.5357248

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abstract = "Inductive-coupling link between stacked chips in a package communicates by using coils made by on-chip Interconnections. An XY-coil layout style allows logic interconnections to go through the coil, which significantly saves Interconnection resources consumed by the coil. However, the logic interconnections generate capacitive-coupling noise on the coil and degrade signal in the inductive-coupling link. In this paper, an extended XY coil with ground shields is presented for noise reduction. Simulation study shows that the noise voltage is reduced to 1/5 of the conventional XY coil. This noise reduction enables to reduce transmit power required for the same BER. Test-chip measurement in 0.18μm CMOS demonstrates that the transmit power at 1Gb/s with BER<10-12 is reduced by 60% compared to the conventional XY coil.",

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An extended XY coil for noise reduction in inductive-coupling link

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