An image sensor/processor 3D stacked module featuring ThruChip interfaces

Masayuki Ikebe; Tetsuya Asai; Masafumi Mori; Toshiyuki Itou; Daisuke Uchida; Yasuhiro Take; Tadahiro Kuroda; Masato Motomura

doi:10.1109/ASPDAC.2017.7858275

An image sensor/processor 3D stacked module featuring ThruChip interfaces

Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

1,000 fps motion vector (MV) estimation and classification engine for highspeed computational imaging in a 3D stacked imager/processor module is proposed, prototyped, assembled, and also tested. The module features 1) ThruChip interfaces for high fps image transfer, 2) orders of magnitude more area/power efficient MV estimation architecture compared to conventional ones, and 3) a cognitive classification scheme employed on MV patterns, enabling the classification of moving objects not possible in conventional proposals.

Original language	English
Title of host publication	2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	7-8
Number of pages	2
ISBN (Electronic)	9781509015580
DOIs	https://doi.org/10.1109/ASPDAC.2017.7858275
Publication status	Published - 2017 Feb 16
Event	22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 - Chiba, Japan Duration: 2017 Jan 16 → 2017 Jan 19

Other

Other	22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
Country/Territory	Japan
City	Chiba
Period	17/1/16 → 17/1/19

ASJC Scopus subject areas

Electrical and Electronic Engineering
Computer Science Applications
Computer Graphics and Computer-Aided Design

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10.1109/ASPDAC.2017.7858275

Cite this

Ikebe, M., Asai, T., Mori, M., Itou, T., Uchida, D., Take, Y., Kuroda, T., & Motomura, M. (2017). An image sensor/processor 3D stacked module featuring ThruChip interfaces. In 2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 (pp. 7-8). Article 7858275 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2017.7858275

An image sensor/processor 3D stacked module featuring ThruChip interfaces. / Ikebe, Masayuki; Asai, Tetsuya; Mori, Masafumi et al.
2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 7-8 7858275.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ikebe, M, Asai, T, Mori, M, Itou, T, Uchida, D, Take, Y, Kuroda, T & Motomura, M 2017, An image sensor/processor 3D stacked module featuring ThruChip interfaces. in 2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017., 7858275, Institute of Electrical and Electronics Engineers Inc., pp. 7-8, 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, 17/1/16. https://doi.org/10.1109/ASPDAC.2017.7858275

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An image sensor/processor 3D stacked module featuring ThruChip interfaces

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