Abstract
This paper presents analysis and simple design guideline for ThruChip Interface (TCI) as located by LC-VCO which is used in high-speed SoC. The electromagnetic interference (EMI) from TCI channels to LC-VCO is analyzed and evaluated. The accuracy of the analysis and design guidelines is verified through the test-chip verification.
Original language | English |
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Pages (from-to) | 659-662 |
Number of pages | 4 |
Journal | IEICE Transactions on Electronics |
Volume | E99C |
Issue number | 6 |
DOIs | |
Publication status | Published - 2016 Jun |
Keywords
- 3D integration
- EMI
- LC-VCO
- TCI
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering