Analytical thruchip inductive coupling channel design optimization

Li Chung Hsu; Junichiro Kadomoto; So Hasegawa; Atsutake Kosuge; Yasuhiro Take; Tadahiro Kuroda

doi:10.1109/ASPDAC.2016.7428098

Analytical thruchip inductive coupling channel design optimization

Li Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

10 Citations (Scopus)

Abstract

ThruChip interface (TCI) is an emerging 3-D integrated circuit stacking technology. TCI utilizes on-chip inductor to build vertical communication channel in near field distance and has been proved to stand comparison with through-siliconvia (TSV) in data rate, power, and reliability. Moreover, it is also cost-effective in manufacturing due to its wireless nature. In this paper, an analytical method is proposed to find near-optimal TCI inductive coupling channel solution. The experiment results show an average 16.8% transmitting current reduction and shrink design time from days to a few minutes.

Original language	English
Title of host publication	2016 21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	731-736
Number of pages	6
Volume	25-28-January-2016
ISBN (Electronic)	9781467395694
DOIs	https://doi.org/10.1109/ASPDAC.2016.7428098
Publication status	Published - 2016 Mar 7
Event	21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016 - Macao, Macao Duration: 2016 Jan 25 → 2016 Jan 28

Other

Other	21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016
Country/Territory	Macao
City	Macao
Period	16/1/25 → 16/1/28

ASJC Scopus subject areas

Electrical and Electronic Engineering
Computer Science Applications
Computer Graphics and Computer-Aided Design

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10.1109/ASPDAC.2016.7428098

Cite this

Hsu, L. C., Kadomoto, J., Hasegawa, S., Kosuge, A., Take, Y., & Kuroda, T. (2016). Analytical thruchip inductive coupling channel design optimization. In 2016 21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016 (Vol. 25-28-January-2016, pp. 731-736). Article 7428098 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2016.7428098

Analytical thruchip inductive coupling channel design optimization. / Hsu, Li Chung; Kadomoto, Junichiro; Hasegawa, So et al.
2016 21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016. Vol. 25-28-January-2016 Institute of Electrical and Electronics Engineers Inc., 2016. p. 731-736 7428098.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hsu, LC, Kadomoto, J, Hasegawa, S, Kosuge, A, Take, Y & Kuroda, T 2016, Analytical thruchip inductive coupling channel design optimization. in 2016 21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016. vol. 25-28-January-2016, 7428098, Institute of Electrical and Electronics Engineers Inc., pp. 731-736, 21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016, Macao, Macao, 16/1/25. https://doi.org/10.1109/ASPDAC.2016.7428098

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AB - ThruChip interface (TCI) is an emerging 3-D integrated circuit stacking technology. TCI utilizes on-chip inductor to build vertical communication channel in near field distance and has been proved to stand comparison with through-siliconvia (TSV) in data rate, power, and reliability. Moreover, it is also cost-effective in manufacturing due to its wireless nature. In this paper, an analytical method is proposed to find near-optimal TCI inductive coupling channel solution. The experiment results show an average 16.8% transmitting current reduction and shrink design time from days to a few minutes.

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Analytical thruchip inductive coupling channel design optimization

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