TY - GEN
T1 - Anodic bonding for integrated capacitive sensors
AU - Esashi, M.
AU - Ura, N.
AU - Matsumoto, Y.
PY - 1992
Y1 - 1992
N2 - Anodic bonding of silicon to Pyrex glass was studied from the viewpoint of its application to integrated capacitive sensors. Equipment that was developed to allow substrate bonding in atmosphere and in vacuum is described. Vertical and lateral electrical feedthrough structures, which have excellent electrical properties and airtight performance, were developed. The vertical feedthrough structures were applied to capacitive sensors. Other bonding-related problems that were studied, such as wafer distortion, circuit damage, and metalization, are noted.
AB - Anodic bonding of silicon to Pyrex glass was studied from the viewpoint of its application to integrated capacitive sensors. Equipment that was developed to allow substrate bonding in atmosphere and in vacuum is described. Vertical and lateral electrical feedthrough structures, which have excellent electrical properties and airtight performance, were developed. The vertical feedthrough structures were applied to capacitive sensors. Other bonding-related problems that were studied, such as wafer distortion, circuit damage, and metalization, are noted.
UR - http://www.scopus.com/inward/record.url?scp=0027084126&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0027084126&partnerID=8YFLogxK
U2 - 10.1109/memsys.1992.187688
DO - 10.1109/memsys.1992.187688
M3 - Conference contribution
AN - SCOPUS:0027084126
SN - 0780304977
SN - 9780780304970
T3 - Proc IEEE Micro Electro Mech Syst Workshop
SP - 43
EP - 48
BT - Proc IEEE Micro Electro Mech Syst Workshop
PB - Publ by IEEE
T2 - Proceedings of the IEEE Micro Electro Mechanical Systems Workshop
Y2 - 4 February 1992 through 7 February 1992
ER -