TY - GEN
T1 - Biaxial Glass Force Plate using Inclined Laser Induced Backside Wet Etching through a Prism
AU - Ono, Nozomi
AU - Nakashima, Rihachiro
AU - Shiratori, Toshihiro
AU - Takahashi, Hidetoshi
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - This paper reports a biaxial force plate designed to measure ground reaction forces in small insects. The device utilizes a glass spring structure to detect both vertical and shear forces, with two laser displacement meters for force capture. A V-shaped groove formed by fiber laser-induced backside wet etching through a triangular prism, allows precise biaxial force measurements. The proposed force plate structure can be fabricated entirely using laser beam processing. The fabricated force plate realized a force resolution of 0.37 μN, providing the significantly high sensitivity for fruit fly measurement.
AB - This paper reports a biaxial force plate designed to measure ground reaction forces in small insects. The device utilizes a glass spring structure to detect both vertical and shear forces, with two laser displacement meters for force capture. A V-shaped groove formed by fiber laser-induced backside wet etching through a triangular prism, allows precise biaxial force measurements. The proposed force plate structure can be fabricated entirely using laser beam processing. The fabricated force plate realized a force resolution of 0.37 μN, providing the significantly high sensitivity for fruit fly measurement.
KW - Displacement sensors
KW - Force plate
KW - Laser processing
KW - Laser-induced backside wet etching
UR - https://www.scopus.com/pages/publications/105001660247
UR - https://www.scopus.com/inward/citedby.url?scp=105001660247&partnerID=8YFLogxK
U2 - 10.1109/MEMS61431.2025.10918017
DO - 10.1109/MEMS61431.2025.10918017
M3 - Conference contribution
AN - SCOPUS:105001660247
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 833
EP - 836
BT - 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems, MEMS 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 38th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2025
Y2 - 19 January 2025 through 23 January 2025
ER -