TY - GEN
T1 - Body Bias Control on a CGRA based on Convex Optimization
AU - Kojima, Takuya
AU - Okuhara, Hayate
AU - Kondo, Masaaki
AU - Amano, Hideharu
N1 - Funding Information:
Acknowledgement This work was supported in part by JSPS KAKENHI Grant 19J21493 and in part by the VLSI Design and Education Center (VDEC), the University of Tokyo in collaboration with Synopsys, Inc and Cadence Design Systems, Inc.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Body biasing is one of the critical techniques to realize more energy-efficient computing with reconfigurable devices, such as Coarse-Grained Reconfigurable Architectures (CGRAs). Its benefit depends on the control granularity, whereas fine-grained control makes it challenging to find the best body bias voltage for each domain due to the complexity of the optimization problem. This work reformulates the optimization problem and introduces continuous relaxation to solve it faster than previous work. Experimental result shows the proposed method can solve the problem within 0.5 sec for all benchmarks in any conditions and demonstrates up to 5.65x speed-up compared to the previous method with negligible loss of accuracy.
AB - Body biasing is one of the critical techniques to realize more energy-efficient computing with reconfigurable devices, such as Coarse-Grained Reconfigurable Architectures (CGRAs). Its benefit depends on the control granularity, whereas fine-grained control makes it challenging to find the best body bias voltage for each domain due to the complexity of the optimization problem. This work reformulates the optimization problem and introduces continuous relaxation to solve it faster than previous work. Experimental result shows the proposed method can solve the problem within 0.5 sec for all benchmarks in any conditions and demonstrates up to 5.65x speed-up compared to the previous method with negligible loss of accuracy.
UR - http://www.scopus.com/inward/record.url?scp=85130821662&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85130821662&partnerID=8YFLogxK
U2 - 10.1109/COOLCHIPS54332.2022.9772708
DO - 10.1109/COOLCHIPS54332.2022.9772708
M3 - Conference contribution
AN - SCOPUS:85130821662
T3 - 25th IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL Chips 2022 - Proceedings
BT - 25th IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL Chips 2022 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 25th IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL Chips 2022
Y2 - 20 April 2022 through 22 April 2022
ER -