Building block operating system for 3D stacked computer systems with inductive coupling interconnect

Shinsuke Hamada; Atsushi Koshiba; Mitaro Namiki; Hideharu Amano

doi:10.1109/ISOCC.2017.8368844

Building block operating system for 3D stacked computer systems with inductive coupling interconnect

Shinsuke Hamada, Atsushi Koshiba, Mitaro Namiki, Hideharu Amano

Department of Information and Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper describes the software system for the building block computing systems. The programs on the system are executed by the building block OS that manages configuration information of the 3D stacked chips and virtualizes the accelerators as the OpenCL functions. In addition, the OS controls the power supply of the chips implemented with SOTB (Silicon on Thin Box). This paper introduces the basic concepts and functions of the software systems for the building block computing systems.

Original language	English
Title of host publication	Proceedings - International SoC Design Conference 2017, ISOCC 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	157-158
Number of pages	2
ISBN (Electronic)	9781538622858
DOIs	https://doi.org/10.1109/ISOCC.2017.8368844
Publication status	Published - 2018 May 29
Event	14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of Duration: 2017 Nov 5 → 2017 Nov 8

Publication series

Name	Proceedings - International SoC Design Conference 2017, ISOCC 2017

Other

Other	14th International SoC Design Conference, ISOCC 2017
Country/Territory	Korea, Republic of
City	Seoul
Period	17/11/5 → 17/11/8

Keywords

OpenCL
Operating System
SOTB
TCI

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/ISOCC.2017.8368844

Cite this

Hamada, S., Koshiba, A., Namiki, M., & Amano, H. (2018). Building block operating system for 3D stacked computer systems with inductive coupling interconnect. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 157-158). (Proceedings - International SoC Design Conference 2017, ISOCC 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368844

Building block operating system for 3D stacked computer systems with inductive coupling interconnect. / Hamada, Shinsuke; Koshiba, Atsushi; Namiki, Mitaro et al.
Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 157-158 (Proceedings - International SoC Design Conference 2017, ISOCC 2017).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hamada, S, Koshiba, A, Namiki, M & Amano, H 2018, Building block operating system for 3D stacked computer systems with inductive coupling interconnect. in Proceedings - International SoC Design Conference 2017, ISOCC 2017. Proceedings - International SoC Design Conference 2017, ISOCC 2017, Institute of Electrical and Electronics Engineers Inc., pp. 157-158, 14th International SoC Design Conference, ISOCC 2017, Seoul, Korea, Republic of, 17/11/5. https://doi.org/10.1109/ISOCC.2017.8368844

Hamada S, Koshiba A, Namiki M, Amano H. Building block operating system for 3D stacked computer systems with inductive coupling interconnect. In Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 157-158. (Proceedings - International SoC Design Conference 2017, ISOCC 2017). doi: 10.1109/ISOCC.2017.8368844

Hamada, Shinsuke ; Koshiba, Atsushi ; Namiki, Mitaro et al. / Building block operating system for 3D stacked computer systems with inductive coupling interconnect. Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 157-158 (Proceedings - International SoC Design Conference 2017, ISOCC 2017).

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Building block operating system for 3D stacked computer systems with inductive coupling interconnect

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Keywords

ASJC Scopus subject areas

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