TY - GEN
T1 - Carbon nanotube bumps for LSI interconnect
AU - Soga, Ikuo
AU - Kondo, Daiyu
AU - Yamaguchi, Yoshitaka
AU - Iwai, Taisuke
AU - Mizukoshi, Masataka
AU - Awano, Yuji
AU - Yube, Kunio
AU - Fujii, Takashi
PY - 2008
Y1 - 2008
N2 - We demonstrate, for the first time, carbon nanotube (CNT) flip chip bumps for LSI modules. The CNT bump is composed of a bundle of multi-walled CNTs. Resilient and flexible CNT bumps make flip chip LSI modules resistant to thermal stress. Furthermore, CNT bumps have a low electrical resistance and robustness over electromigration. In the experiment, the CNT bumps were used to connect a test evaluation group (TEG) chip and a host substrate, and their electrical resistance was evaluated. We found that the electrical contacts of CNT bumps with the chip and the substrate are important. For a good electrical contact, the CNT bumps were coated with gold and fixed to the chip and substrate. The resultant CNT bump with a diameter of 170 μm and a height of 100 μm exhibited a low resistance of 2.3 Ω. We then evaluated the flexibility of CNT bumps by pressing the TEG chip and measuring the displacement. The displacement between the TEG chip and host substrate was 10-20 % of the bump height, demonstrating an excellent flexibility.
AB - We demonstrate, for the first time, carbon nanotube (CNT) flip chip bumps for LSI modules. The CNT bump is composed of a bundle of multi-walled CNTs. Resilient and flexible CNT bumps make flip chip LSI modules resistant to thermal stress. Furthermore, CNT bumps have a low electrical resistance and robustness over electromigration. In the experiment, the CNT bumps were used to connect a test evaluation group (TEG) chip and a host substrate, and their electrical resistance was evaluated. We found that the electrical contacts of CNT bumps with the chip and the substrate are important. For a good electrical contact, the CNT bumps were coated with gold and fixed to the chip and substrate. The resultant CNT bump with a diameter of 170 μm and a height of 100 μm exhibited a low resistance of 2.3 Ω. We then evaluated the flexibility of CNT bumps by pressing the TEG chip and measuring the displacement. The displacement between the TEG chip and host substrate was 10-20 % of the bump height, demonstrating an excellent flexibility.
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U2 - 10.1109/ECTC.2008.4550158
DO - 10.1109/ECTC.2008.4550158
M3 - Conference contribution
AN - SCOPUS:51349117394
SN - 9781424422302
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1390
EP - 1394
BT - 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
T2 - 2008 58th Electronic Components and Technology Conference, ECTC
Y2 - 27 May 2008 through 30 May 2008
ER -