Carbon nanotube bumps for LSI interconnect

Ikuo Soga, Daiyu Kondo, Yoshitaka Yamaguchi, Taisuke Iwai, Masataka Mizukoshi, Yuji Awano, Kunio Yube, Takashi Fujii

Research output: Chapter in Book/Report/Conference proceedingConference contribution

50 Citations (Scopus)


We demonstrate, for the first time, carbon nanotube (CNT) flip chip bumps for LSI modules. The CNT bump is composed of a bundle of multi-walled CNTs. Resilient and flexible CNT bumps make flip chip LSI modules resistant to thermal stress. Furthermore, CNT bumps have a low electrical resistance and robustness over electromigration. In the experiment, the CNT bumps were used to connect a test evaluation group (TEG) chip and a host substrate, and their electrical resistance was evaluated. We found that the electrical contacts of CNT bumps with the chip and the substrate are important. For a good electrical contact, the CNT bumps were coated with gold and fixed to the chip and substrate. The resultant CNT bump with a diameter of 170 μm and a height of 100 μm exhibited a low resistance of 2.3 Ω. We then evaluated the flexibility of CNT bumps by pressing the TEG chip and measuring the displacement. The displacement between the TEG chip and host substrate was 10-20 % of the bump height, demonstrating an excellent flexibility.

Original languageEnglish
Title of host publication2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Number of pages5
Publication statusPublished - 2008
Externally publishedYes
Event2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: 2008 May 272008 May 30

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503


Other2008 58th Electronic Components and Technology Conference, ECTC
Country/TerritoryUnited States
CityLake Buena Vista, FL

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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