Carbon Nanotubes for Interconnects

Mizuhisa Nihei; Motonobu Sato; Akio Kawabata; Shintaro Sato; Yuji Awano

doi:10.1002/9781119963677.ch13

Carbon Nanotubes for Interconnects

Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano

Research output: Chapter in Book/Report/Conference proceeding › Chapter

1 Citation (Scopus)

Abstract

Carbon nanotubes (CNTs) exhibit excellent electrical properties that include a long mean free path, a high current-carrying capability and high thermal conductivity. Because of these factors, with their low electrical resistance and large electromigration tolerance, CNTs have been expected for use as aggressively scaled interconnects for next-generation LSIs. We report our trials of using CNT bundles as vertical interconnects, such as contact plugs on CMOS and vias on Cu wire.

Original language	English
Title of host publication	Advanced Interconnects for ULSI Technology
Publisher	John Wiley and Sons
Pages	491-502
Number of pages	12
ISBN (Print)	9780470662540
DOIs	https://doi.org/10.1002/9781119963677.ch13
Publication status	Published - 2012 Feb 17
Externally published	Yes

Keywords

Carbon nanotube
Interconnect
Via

ASJC Scopus subject areas

Materials Science(all)

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10.1002/9781119963677.ch13

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AU - Nihei, Mizuhisa

AU - Sato, Motonobu

AU - Kawabata, Akio

AU - Sato, Shintaro

AU - Awano, Yuji

PY - 2012/2/17

Y1 - 2012/2/17

N2 - Carbon nanotubes (CNTs) exhibit excellent electrical properties that include a long mean free path, a high current-carrying capability and high thermal conductivity. Because of these factors, with their low electrical resistance and large electromigration tolerance, CNTs have been expected for use as aggressively scaled interconnects for next-generation LSIs. We report our trials of using CNT bundles as vertical interconnects, such as contact plugs on CMOS and vias on Cu wire.

AB - Carbon nanotubes (CNTs) exhibit excellent electrical properties that include a long mean free path, a high current-carrying capability and high thermal conductivity. Because of these factors, with their low electrical resistance and large electromigration tolerance, CNTs have been expected for use as aggressively scaled interconnects for next-generation LSIs. We report our trials of using CNT bundles as vertical interconnects, such as contact plugs on CMOS and vias on Cu wire.

KW - Carbon nanotube

KW - Interconnect

KW - Via

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PB - John Wiley and Sons

ER -

Carbon Nanotubes for Interconnects

Abstract

Keywords

ASJC Scopus subject areas

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