Skip to main navigation Skip to search Skip to main content

Carbon nanotubes for VLSI: Interconnect and transistor applications

  • Y. Awano
  • , S. Sato
  • , M. Nihei
  • , T. Sakai
  • , Y. Ohno
  • , T. Mizutani

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    We report the present status of Carbon Nanotube (CNT) CVD material technologies and their applications for via interconnects and FETs for VLSI. We succeeded in growing multi-walled CNTs (MWNTs) with the highest shell density (as high as 1013/cm2) and in fabricating via interconnects with high robustness against a high current density. We also report a Si-process compatible technique to control carrier polarity of Single-walled CNT (SWNT) FETs by utilizing fixed charges introduced by the gate oxide. High-performance p- and n-type CNT-FETs and CMOS inverters with stability in air have been realized.

    Original languageEnglish
    Title of host publicationProceedings of 2011 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2011
    Pages10-11
    Number of pages2
    DOIs
    Publication statusPublished - 2011 Jul 11
    Event2011 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2011 - Hsinchu, Taiwan, Province of China
    Duration: 2011 Apr 252011 Apr 27

    Publication series

    NameInternational Symposium on VLSI Technology, Systems, and Applications, Proceedings

    Other

    Other2011 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2011
    Country/TerritoryTaiwan, Province of China
    CityHsinchu
    Period11/4/2511/4/27

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

    Fingerprint

    Dive into the research topics of 'Carbon nanotubes for VLSI: Interconnect and transistor applications'. Together they form a unique fingerprint.

    Cite this