Centrifugal and hydroplaning phenomena in high-speed polishing

Wu Le Zhu, Soufian Ben Achour, Anthony Beaucamp

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)


Super fine polishing with compliant tools can achieve nanoscale roughness, but has limited productivity due to low material removal rate (MRR). Increased spindle speed in high-speed polishing (HSP) might increase MRR, but significant challenges appear above 10,000 rpm because of centrifugal deformation of the tool and pad lifting due to hydroplaning phenomenon. Here, a tool offset compensation strategy is proposed for centrifugal deformation and novel pad patterning design that mitigates hydroplaning. Through this new approach, linear increase in MRR for spindle speed up to 24,000 rpm is demonstrated. This work lays the foundation for future developments of HSP in fabrication of ultraprecision optics.

Original languageEnglish
Pages (from-to)369-372
Number of pages4
JournalCIRP Annals
Issue number1
Publication statusPublished - 2019
Externally publishedYes


  • High-speed polishing
  • Material removal
  • Ultra precision

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering


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