Abstract
Chromium aluminum nitride based films were synthesized by the cathodic arc method using an alloy cathode, and annealed in a vacuum chamber at 800, 900 and 1000 °C. XRD analyses showed that the (Cr,Al,Si,Y)N films maintained a cubic phase up to 800 °C, but changed to a mixed phase after post-annealing at temperatures of more than 900 °C. Cr2N segregation and partial transformation from a cubic to hexagonal phase at over 800 °C were confirmed for (Cr,Al,Si)N and (Cr,Al,Y)N. The lattice parameters for cubic (Cr,Al,Si)N and (Cr,Al,Y)N (0.416 nm) decreased to 0.411 nm and 0.413 nm, respectively, after annealing at 900 °C. The lattice parameter for (Cr,Al,Si,Y)N changed from 0.417 nm to 0.413 nm after annealing at 900 °C. The microhardness of (Cr,Al,Y)N was kept constant at 800 °C, whereas that of (Cr,Al,Si)N and (Cr,Al,Si,Y)N increased slightly between 800 and 900 °C. In this study, hardness, microstructure and lattice parameters were analyzed and discussed as a function of the annealing temperature.
Original language | English |
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Pages (from-to) | 786-789 |
Number of pages | 4 |
Journal | Surface and Coatings Technology |
Volume | 202 |
Issue number | 4-7 |
DOIs | |
Publication status | Published - 2007 Dec 15 |
Keywords
- (Cr,Al)N
- Microhardness
- Microstructure
- Thermal stability
ASJC Scopus subject areas
- Chemistry(all)
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Materials Chemistry