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ConductAR: An augmented reality based tool for iterative design of conductive ink circuits

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recent advances in materials science have resulted in a range of commercially viable and easy-To-use conductive inks which novices, hobbyists, educators, students and researchers are now using to design and build interactive circuits quickly. Despite the ease with which practitioners can construct working circuits, one of the major limitations of designing circuits on-The-fly is the difficulty of detecting and understanding errors in prototype circuits. As well as short-and open-circuits, which often prevent a circuit from working at all, more subtle issues like high resistance traces can result in poor performance. Many users can't readily work out how to successfully modify their circuits, and they often don't have the tools or expertise to measure the relevant circuit parameters. In this paper we present ConductAR, a tool which can recognize and analyze handdrawn, printed and hybrid conductive ink patterns. An onscreen augmented reality style interaction helps users to understand and enhance circuit operation. A key element of ConductAR is its ability to calculate the resistance of a circuit using a camera attached to an off-The-shelf PC or tablet. Our sparse coding technique is fast enough to support rapid iterative prototyping on real circuits using a conductive ink marker and/or eraser as shown in Figure 1. The system thereby enhances the feasibility of circuit prototyping with conductive ink.

Original languageEnglish
Title of host publicationUbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing
PublisherAssociation for Computing Machinery, Inc
Pages791-800
Number of pages10
ISBN (Electronic)9781450335744
DOIs
Publication statusPublished - 2015 Sept 7
Externally publishedYes
Event3rd ACM International Joint Conference on Pervasive and Ubiquitous Computing, UbiComp 2015 - Osaka, Japan
Duration: 2015 Sept 72015 Sept 11

Publication series

NameUbiComp 2015 - Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing

Other

Other3rd ACM International Joint Conference on Pervasive and Ubiquitous Computing, UbiComp 2015
Country/TerritoryJapan
CityOsaka
Period15/9/715/9/11

Keywords

  • Conductive Ink
  • Education
  • Makers
  • Rapid Prototyping

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Software

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