D-tdma data buses with CSMA/CD arbitration bus on wireless 3D IC

Go Matsumura, Michihiro Koibuchi, Hideharu Amano, Hiroki Matsutani

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Because of the increase in cost for chip fabrication, design-ing a chip family in accordance with the application is be-coming an expensive choice. Wireless 3D IC design offers flexibility to connect known-good-dies selected after chip fabrication. It can stack an arbitrary number of chips at low cost. In this paper, dynamic time division multiple access (D-TDMA) is used for vertical broadcast buses for high communication efficiency of interchip network. However, to implement simple D-TDMA based 3D IC, large area and energy overheads are needed for arbitration since another inductor is needed for sending just several bits as arbitra-tion signal in addition to an inductor for the data transfer. We resolve this problem to employ a carrier sense multiple access with collision detection (CSMA/CD) for arbitration of D-TDMA vertical broadcast buses. Evaluation results show that the proposed bus architecture reduces the num-ber of inductors by 73.6% compared to a simple counter-part which employs D-TDMA based 3D buses. The results also show that an application execution time increases only by 0.3% at most.

Original languageEnglish
Title of host publicationProceedings of the 13th IASTED International Conference on Parallel and Distributed Computing and Networks, PDCN 2016
PublisherActa Press
Pages242-249
Number of pages8
ISBN (Electronic)9780889869790
DOIs
Publication statusPublished - 2016
Event13th IASTED International Conference on Parallel and Distributed Computing and Networks, PDCN 2016 - Innsbruck, Austria
Duration: 2016 Feb 152016 Feb 16

Publication series

NameProceedings of the 13th IASTED International Conference on Parallel and Distributed Computing and Networks, PDCN 2016

Other

Other13th IASTED International Conference on Parallel and Distributed Computing and Networks, PDCN 2016
Country/TerritoryAustria
CityInnsbruck
Period16/2/1516/2/16

Keywords

  • Bus
  • Chip Multi-Processor
  • Network-on-Chip
  • Wireless 3D IC

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Software

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