A damage free dicing method for MEMS devices has been researched in this paper. The method is based on the bonding and detachment of a glass plate cap by using a thermoplastic adhesive. The sand blast technique was used for fabrication of the glass cap wafer, which has concavities with depth of 100 μm. The thermoplastic adhesive (STAYSTIK373, Techno Alpha Co. Ltd.) was screen printed on the glass cap wafer. The glass cap wafer was thermocompression-bonded to silicon wafer at 210°C and diced to individual chips. The glass cap plate was easily detached at 300°C. This method prevented MEMS devices from suffering contamination by water or dicing dust during the dicing process. The method is easily applied to current mass-production processes, because the method is accomplished with inexpensive materials and well-established equipment. The process conditions and examples have been explained in the paper.
|Title of host publication
|2002 IEEE/LEOS International Conference on Optical MEMs, OMEMS 2002 - Conference Digest
|Institute of Electrical and Electronics Engineers Inc.
|Number of pages
|Published - 2002
|IEEE/LEOS International Conference on Optical MEMs, OMEMS 2002 - Lugano, Switzerland
Duration: 2002 Aug 20 → 2002 Aug 23
|IEEE/LEOS International Conference on Optical MEMs, OMEMS 2002
|02/8/20 → 02/8/23
ASJC Scopus subject areas
- Hardware and Architecture
- Control and Systems Engineering
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials