Damage Free Dicing Method for MEMS Devices

Yoshinori Matsumoto, Yoshio Awatani, Kei Kato

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


This paper presents a dicing method for MEMS devices without dameges during the dicing process. The method is based on bonding and detachment of a glass cap plate by using thermoplastic adhesive. Sand blast technique was used for the fabrication of glass cap plate which has concavities in the depth of 100^m. The thermoplastic adhesive was screen printed on the glass plate. The plate was thermocompression-bonded to silicon wafer at 210°C and diced to individual chips without damages from water or dicing dusts. The chip was mounted in the package while the glass cap was removed at 330C.

Original languageEnglish
Pages (from-to)255-256
Number of pages2
Journalieej transactions on sensors and micromachines
Issue number7
Publication statusPublished - 2003


  • MEMS
  • damage free
  • dicing
  • thermocompression-bonding
  • thermoplastic adhesive

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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