Abstract
Good adhesive nickel film was deposited on a glass substrate with electroless nickel plating and photolithography technique. Line-and-space metal patterns were deposited on the glass substrate and the resolution was approximately 20|m. Through holes on a 500|m-thickness glass substrate were fabricated by sandblast method, and the holes were metalized by using dry-film and the plating. Connection yield was 100% in 4cm2 glass substrate, and the resistance of the through-hole was less than 0.05Ω. Keywords : glass substrate, electorless plating, adherence, through hole, photolithography.
| Original language | English |
|---|---|
| Pages (from-to) | 313-314 |
| Number of pages | 2 |
| Journal | ieej transactions on sensors and micromachines |
| Volume | 123 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - 2003 |
Keywords
- adherence
- electorless plating
- glass substrate
- photolithography
- through hole
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering