TY - GEN
T1 - Design automation methodology of a critical path monitor for adaptive voltage controls
AU - Kazami, Ryosuke
AU - Okuhara, Hayate
AU - Amano, Hideharu
N1 - Funding Information:
This work was supported by JSPS KAKENHI S Grant Number 25220002. The device model of SOTB in this study has been provided by VLSI Design and Education Center (VDEC), the University of Tokyo in collaboration with Renesas Electronics Corp. The authors also thank Synopsys Inc. for the EDA tools support.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/6/5
Y1 - 2018/6/5
N2 - The development of recent CMOS technologies such as Fully Depleted Silicon on Insulator (FD-SOI) allows VLSI systems to operate with lower power than the conventional bulk transistors [1, 2]. Thanks to its high degree of noise immunity, low power supply voltages (VDD) can be applied to the FD-SOI devices. Also, since the effect of body biasing is further endorsed in such devices, adaptive voltage control for both power supply voltage and body bias voltages (VBN for nMOS and VBP for pMOS) can be aggressively used.
AB - The development of recent CMOS technologies such as Fully Depleted Silicon on Insulator (FD-SOI) allows VLSI systems to operate with lower power than the conventional bulk transistors [1, 2]. Thanks to its high degree of noise immunity, low power supply voltages (VDD) can be applied to the FD-SOI devices. Also, since the effect of body biasing is further endorsed in such devices, adaptive voltage control for both power supply voltage and body bias voltages (VBN for nMOS and VBP for pMOS) can be aggressively used.
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U2 - 10.1109/CoolChips.2018.8373073
DO - 10.1109/CoolChips.2018.8373073
M3 - Conference contribution
AN - SCOPUS:85049012425
T3 - 21st IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL Chips 2018 - Proceedings
SP - 1
EP - 3
BT - 21st IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL Chips 2018 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL Chips 2018
Y2 - 18 April 2018 through 20 April 2018
ER -