Ductile and brittle mode grinding of fused silica

Peng Yao, Nobuhito Yoshihara, Nobuteru Hitomi, Jiwang Yan, Tsunemoto Kuriyagawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)


There is a demand for high-efficiency and high surface integrity grinding of fused silica. Ductile grinding is an ideal method for producing a mirror finished surface on hard and brittle materials to significantly decrease polishing time. However, the fused silica is still difficult to ductile grind because of its high brittleness. A creep feed taper grinding method was applied to investigate the relationship between maximum grit depth of cut and surface integrity of fused silica. Ductile mode grinding was achieved on fused silica. When the depth of cut exceeds the critical wheel depth of cut, the surface suddenly changes from the ductile mode to the brittle mode. At the same ratio of wheel speed and table speed, the critical wheel depth of cut is noticeably increased by increasing the wheel speed which caused an increase in the temperature at the interface of grains and workpiece. The depth of subsurface damage (SSD) was investigated by polishing the ground surface. The experiment results show that the depth of SSD is deepest in transition mode and stables in brittle mode.

Original languageEnglish
Title of host publicationAdvances in Precision Engineering
PublisherTrans Tech Publications Ltd
Number of pages5
ISBN (Print)9780878492565
Publication statusPublished - 2010
Externally publishedYes

Publication series

NameKey Engineering Materials
Volume447 448
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795


  • Brittle mode
  • Creep feed grinding
  • Ductile mode
  • Fused silica
  • Subsurface damage

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering


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