TY - JOUR
T1 - Ductile regime turning at large tool feed
AU - Yan, Jiwang
AU - Syoji, Katsuo
AU - Kuriyagawa, Tsunemoto
AU - Suzuki, Hirofumi
N1 - Funding Information:
This research was partially supported by the Ministry of Education, Science, Sports and Culture, Grant-in-Aid for Encouragement of Young Scientists (Project Number 13750090) and the Japan New Energy and Industrial Technology Development Organization (NEDO) (Project Number 01A38004). The authors would like to thank Tokyo Diamond Tool Manufacturing Co., Ltd. for collaboration in fabricating diamond tools and Mitsubishi Material Co. for providing single crystal silicon specimens and related data. We also extend our thanks to Dr. Ranga Komanduri, Oklahoma State University, USA for his interest, encouragement and valuable comments in this study.
PY - 2002/2/28
Y1 - 2002/2/28
N2 - Ductile regime turning is a new technology for obtaining a crack-free surface on brittle material. However, the fundamental obstacle for industrial application of this technology is diamond tool wear. This problem is difficult to solve for existing methods of turning with round-nosed tools due to limitation on tool feed. In this paper, ductile regime turning using the straight-nosed diamond tool is proposed. This method enables thinning of undeformed chip thickness in the nanometric range and at the same time provides significant cutting width ensuring plain strain conditions. Adopting a small cutting edge angle enables ductile regime turning at a large tool feed up to a few tens of micrometers. Single crystal silicon is machined and chip morphology and machined surface texture are examined for clarifying the brittle-ductile transition mechanism. Ductile surface with nanometric roughness is obtained and generation of plastically deformed continuous chips is confirmed.
AB - Ductile regime turning is a new technology for obtaining a crack-free surface on brittle material. However, the fundamental obstacle for industrial application of this technology is diamond tool wear. This problem is difficult to solve for existing methods of turning with round-nosed tools due to limitation on tool feed. In this paper, ductile regime turning using the straight-nosed diamond tool is proposed. This method enables thinning of undeformed chip thickness in the nanometric range and at the same time provides significant cutting width ensuring plain strain conditions. Adopting a small cutting edge angle enables ductile regime turning at a large tool feed up to a few tens of micrometers. Single crystal silicon is machined and chip morphology and machined surface texture are examined for clarifying the brittle-ductile transition mechanism. Ductile surface with nanometric roughness is obtained and generation of plastically deformed continuous chips is confirmed.
KW - Brittle material
KW - Brittle-ductile transition
KW - Diamond turning
KW - Ductile regime machining
KW - Tool feed
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U2 - 10.1016/S0924-0136(01)01218-3
DO - 10.1016/S0924-0136(01)01218-3
M3 - Article
AN - SCOPUS:0037186675
SN - 0924-0136
VL - 121
SP - 363
EP - 372
JO - Journal of Materials Processing Technology
JF - Journal of Materials Processing Technology
IS - 2-3
ER -