TY - GEN
T1 - Dynamic power on/off method for 3D NoCs with wireless inductive-coupling links
AU - Zhang, Hao
AU - Matsutani, Hiroki
AU - Koibuchi, Michihiro
AU - Amano, Hideharu
PY - 2013/8/15
Y1 - 2013/8/15
N2 - Network-on-Chips (NoCs) with wireless inductive coupling have been utilized in real heterogeneous multicore systems. Although the inductive-coupling itself is energy-efficient (e.g., 0.14pJ per bit [1]), inductors continuously consume a certain amount of power, regardless of packet transfers. That is, inductors waste significant power especially when the utilization of vertical links (i.e., inductors) is low, which is a typical use case of 3-D ICs that the most communications are within a chip while the communications between chips are infrequent. Such power can be reduced by shutting down the link by controlling bias voltage of transistors used in the transmitter and receiver. Here, we propose generalized link on-off techniques for wireless NoCs with irregular network topologies. The simulation shows that the proposed low-power techniques reduce the power consumption by 43.8%-55.0%.
AB - Network-on-Chips (NoCs) with wireless inductive coupling have been utilized in real heterogeneous multicore systems. Although the inductive-coupling itself is energy-efficient (e.g., 0.14pJ per bit [1]), inductors continuously consume a certain amount of power, regardless of packet transfers. That is, inductors waste significant power especially when the utilization of vertical links (i.e., inductors) is low, which is a typical use case of 3-D ICs that the most communications are within a chip while the communications between chips are infrequent. Such power can be reduced by shutting down the link by controlling bias voltage of transistors used in the transmitter and receiver. Here, we propose generalized link on-off techniques for wireless NoCs with irregular network topologies. The simulation shows that the proposed low-power techniques reduce the power consumption by 43.8%-55.0%.
KW - Wireless NoC and On/Off link
UR - http://www.scopus.com/inward/record.url?scp=84881322790&partnerID=8YFLogxK
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U2 - 10.1109/CoolChips.2013.6547924
DO - 10.1109/CoolChips.2013.6547924
M3 - Conference contribution
AN - SCOPUS:84881322790
SN - 9781467357814
T3 - IEEE Symposium on Low-Power and High-Speed Chips - Proceedings for 2013 COOL Chips XVI
BT - IEEE Symposium on Low-Power and High-Speed Chips - Proceedings for 2013 COOL Chips XVI
T2 - 16th IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips 2013
Y2 - 17 April 2013 through 19 April 2013
ER -