TY - GEN
T1 - Effects of target compliance on a high-speed droplet impact
AU - Sanada, Toshiyuki
AU - Ando, Keita
AU - Colonius, Tim
PY - 2012
Y1 - 2012
N2 - High speed spray cleaning which utilize droplets impact has been used for removing contaminants from wafer surface. When a droplet impacts a solid surface at high speed, the contact periphery expands very quickly and liquid compressibility plays an important role in the initial dynamics and the formation of lateral jets. Impact results in high pressures that can clean or damage the surface. In this study, we numerically investigated a high speed droplet impacts on a solid wall. In order to compare the available theory and experiments, 1D, 2D and axisymmetric solutions are obtained. The generated pressures, shock speeds, and the lateral jetting mechanism are investigated; especially the effect of target compliance is focused.
AB - High speed spray cleaning which utilize droplets impact has been used for removing contaminants from wafer surface. When a droplet impacts a solid surface at high speed, the contact periphery expands very quickly and liquid compressibility plays an important role in the initial dynamics and the formation of lateral jets. Impact results in high pressures that can clean or damage the surface. In this study, we numerically investigated a high speed droplet impacts on a solid wall. In order to compare the available theory and experiments, 1D, 2D and axisymmetric solutions are obtained. The generated pressures, shock speeds, and the lateral jetting mechanism are investigated; especially the effect of target compliance is focused.
KW - High-speed droplet impact
KW - Numerical simulation
KW - Side jet
KW - Target compliance
UR - http://www.scopus.com/inward/record.url?scp=84860130324&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84860130324&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/SSP.187.137
DO - 10.4028/www.scientific.net/SSP.187.137
M3 - Conference contribution
AN - SCOPUS:84860130324
SN - 9783037853887
T3 - Solid State Phenomena
SP - 137
EP - 140
BT - Ultra Clean Processing of Semiconductor Surfaces X
PB - Trans Tech Publications Ltd
T2 - 10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2010
Y2 - 20 September 2010 through 22 September 2010
ER -