Abstract
The authors simulated the electron dynamics and physics in sub-quarter-micron-gate HEMTs (high electron mobility transistors) and fabricated devices for testing their theories on the short-channel effect. They confirmed near-ballistic electron transport under the gate and predicted transverse-domain formation. They introduce a parameter called the channel aspect ratio, which could serve as a design rule for determining the extent of the short-channel effect. Measurements show that the threshold voltage shift is almost negligible for gates as short as 0.14 μm. Thus, within the range studied, HEMTs do require a special design that would limit their applications.
Original language | English |
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Pages | 46-55 |
Number of pages | 10 |
Publication status | Published - 1989 Dec 1 |
Externally published | Yes |
Event | Proceedings IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits - Ithaca, NY, USA Duration: 1989 Aug 7 → 1989 Aug 9 |
Other
Other | Proceedings IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits |
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City | Ithaca, NY, USA |
Period | 89/8/7 → 89/8/9 |
ASJC Scopus subject areas
- Engineering(all)