Evaluation of interfacial strength by multi-stages peel test

Keyphrases

• Dead Weight 83%
• Fracture Test 41%
• Si Layer 41%
• Cu Layer 41%
• Cu-Si 41%
• Elastic Mismatch 41%
• Phase Angle 41%
• Cr Layer 41%
• Polymer Thin Films 41%
• Thermal Stress 41%
• Electronic Devices 41%
• Functional Devices 41%
• Interface Strength 41%

Engineering

• Deadweight 83%
• Interface Strength 41%
• Thermal Stress 41%
• Phase Angle 41%

Material Science

• Multilayer 100%
• Thermal Stress 50%
• Fracture Toughness Testing 50%