Feasibility study of 45-nm-node scaled-down Cu interconnects with molecular-pore-stacking (MPS) SiOCH films
- Munehiro Tada
- , Hiroto Ohtake
- , Fuminori Ito
- , Mitsuru Narihiro
- , Toshiji Taiji
- , Yoshiko Kasama
- , Tsuneo Takeuchi
- , Kouichi Arai
- , N. Furutake
- , Noriaki Oda
- , Makoto Sekine
- , Yoshihiro Hayashi
Research output: Contribution to journal › Article › peer-review
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(Scopus)