TY - GEN
T1 - Flexible distributed capacitive sensor with encapsulated ferroelectric liquid
AU - Hotta, Y.
AU - Zhang, Y.
AU - Miki, N.
PY - 2011/4/13
Y1 - 2011/4/13
N2 - We demonstrate flexible and highly sensitive capacitive sensor arrays that encapsulate DI water as dielectric. DI water, which is a ferroelectric liquid and has a relative dielectric constant of approximately 80, could increase the capacitance of the sensor and enhance the sensitivity while maintaining flexibility of the sensor with electrodes patterned on flexible PDMS substrates. The proposed sensor was microfabricated and demonstrated successfully 40 times greater sensitivity than sensors without DI water. Since DI water is incompressible fluid, it restricted the displacements of the electrodes. We designed a reservoir of DI water where the DI water between the electrodes could escape, which allowed more deformation of the PDMS substrates and successfully augmented the sensitivity of the proposed sensor.
AB - We demonstrate flexible and highly sensitive capacitive sensor arrays that encapsulate DI water as dielectric. DI water, which is a ferroelectric liquid and has a relative dielectric constant of approximately 80, could increase the capacitance of the sensor and enhance the sensitivity while maintaining flexibility of the sensor with electrodes patterned on flexible PDMS substrates. The proposed sensor was microfabricated and demonstrated successfully 40 times greater sensitivity than sensors without DI water. Since DI water is incompressible fluid, it restricted the displacements of the electrodes. We designed a reservoir of DI water where the DI water between the electrodes could escape, which allowed more deformation of the PDMS substrates and successfully augmented the sensitivity of the proposed sensor.
UR - http://www.scopus.com/inward/record.url?scp=79953804306&partnerID=8YFLogxK
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U2 - 10.1109/MEMSYS.2011.5734489
DO - 10.1109/MEMSYS.2011.5734489
M3 - Conference contribution
AN - SCOPUS:79953804306
SN - 9781424496327
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 573
EP - 576
BT - 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
T2 - 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Y2 - 23 January 2011 through 27 January 2011
ER -