Generation of micro/nano hybrid surface structures on copper by femtosecond pulsed laser irradiation

Ayumi Nakajima, Masaki Omiya, Jiwang Yan

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)


The delamination of copper lead frames from epoxy molding compounds (EMC) is a severe problem for microelectronic devices, as it leads to reduced heat dissipation or circuit breakage. The micro/nanoscale surface structuring of copper is a promising method to improve the copper–EMC interfacial adhesion. In this study, the generation of micro/nano hybrid structures on copper surfaces through femtosecond pulsed laser irradiation is proposed to improve interfacial adhesion. The micro/nano hybrid structures were realized by generating nanoscale laser-induced periodic surface structures (LIPSS) on microscale parallel grooves. Several types of hybrid surface structures were generated by changing the laser polarization direction, fluence, and scanning speed. At a specific aspect ratio of microgrooves, a latticed structure was generated on the sides of microgrooves by combining LIPSS formation and direct laser interference patterning. This study provides an efficient method for the micro/nanoscale hybrid surface structure formation for interfacial adhesion improvement between copper and EMC.

Original languageEnglish
Pages (from-to)274-282
Number of pages9
JournalNanomanufacturing and Metrology
Issue number3
Publication statusPublished - 2022 Sept


  • Copper
  • Direct laser interference patterning
  • Femtosecond pulsed laser
  • Metal surface
  • Micro/nano hybrid structures

ASJC Scopus subject areas

  • Materials Science (miscellaneous)
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering


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