High efficiency precision surface grinding of fused silica

Peng Yao, Yadong Gong, Suoxian Yuan, Nobuhito Yoshihara, Jiwang Yan, Tsunemoto Kuriyagawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)


High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.

Original languageEnglish
Title of host publicationMaterials Processing Technology
Number of pages5
Publication statusPublished - 2012
Externally publishedYes
Event2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011 - Guilin, China
Duration: 2011 Dec 162011 Dec 18

Publication series

NameAdvanced Materials Research
ISSN (Print)1022-6680


Other2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011


  • Creep feed grinding
  • Fused silica
  • Undeformed chip thickness
  • Wheel wear

ASJC Scopus subject areas

  • General Engineering


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